Original article by YUFA Polymer.
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When dealing with advanced semiconductor devices, the tray is not a simple accessory—it directly affects yield, reliability and production cost.
For BGA, LGA, CPU and FPGA devices, using a low-temperature tray (125–150°C) often leads to:
· Warpage during baking
· Particle contamination
· Ball deformation or solder shift
· Contact failure (LGA)
· Device scrap and severe RMA loss
And the root cause is simple:
The tray material cannot withstand the required temperature.
Why do these devices require 150–180°C trays?
1. BGA solder balls are extremely sensitive to heat
During baking, test and burn-in, temperatures typically reach 150–170°C.
Any tray deformation will cause uneven stress → solder ball shift → poor reflow quality.
2. LGA pads are sensitive to particles and ion contamination
Low-grade trays tend to release VOCs, ionic residues or particles at high temperatures.
These contaminants can cause LGA contact failure.
3. CPU/FPGA require high-temperature Burn-in
Server processors, AI accelerators and industrial ICs require 160–175°C long-term aging tests.
Only high-temperature resins (PPS/PES/PEI) can remain dimensionally stable under these conditions.
4. High-value IC = extremely high cost of failure
An FPGA can cost dozens or even hundreds of dollars.
A single tray failure can damage an entire batch.
For high-end devices, the JEDEC tray is a critical part of the reliability chain, not a consumable.
Why choose our 150–180°C JEDEC Tray?
· PPS / PES high-temperature resin
· Excellent dimensional stability under 150–180°C
· Ultra-low warpage for BGA/LGA testing
· Low contamination: no halogen, low ionic, low VOC
· Fully JEDEC-compliant and compatible with global handlers
If you manufacture FPGA, CPU, AI processors, BGA memory, or automotive-grade ICs
a high-temperature JEDEC tray is essential for quality and reliability.
�� Contact Us
YUFA Polymer Products Co., Ltd.
�� Address: Shenzhen, China
�� Email: info@yufapolymer.com
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